Chemical etching of Cu-ETP copper

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dc.contributor.authorÇakir, O
dc.contributor.authorTemel, H
dc.contributor.authorKiyak, M
dc.date.accessioned2024-04-24T16:15:09Z
dc.date.available2024-04-24T16:15:09Z
dc.date.issued2005
dc.departmentDicle Üniversitesien_US
dc.description8th International Conference on Advances in Materials and Processing Technologies/13th International Conference on Achievements in Mechanical and Materials Engineering -- MAY 16-19, 2005 -- Gliwice Wisla, POLANDen_US
dc.description.abstractChemical etching is the controlled dissolution of workpiece material by contact with strong chemical solution. The process can be applied to any material. Copper is one of the extensively used engineering material in the fabrication of microelectronic components, microengineered structures and precision parts by using chemical etching process. In this study, copper is chemically etched. with two different etchants (ferric chloride and cupric chloride) at 50 degrees C. The effects of selected etchants and machining conditions on the depth of etch and surface roughness were investigated. The experimental study provided that ferric chloride produced the fastest chemical etch rate, but cupric chloride produced the smoothest surface quality. (c) 2005 Elsevier B.V. All rights reserved.en_US
dc.identifier.doi10.1016/j.jmatprotec.2005.02.035
dc.identifier.endpage279en_US
dc.identifier.issn0924-0136
dc.identifier.scopus2-s2.0-17844395728
dc.identifier.scopusqualityQ1
dc.identifier.startpage275en_US
dc.identifier.urihttps://doi.org/10.1016/j.jmatprotec.2005.02.035
dc.identifier.urihttps://hdl.handle.net/11468/15673
dc.identifier.volume162en_US
dc.identifier.wosWOS:000229375500044
dc.identifier.wosqualityQ2
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.language.isoenen_US
dc.publisherElsevier Science Saen_US
dc.relation.ispartofJournal of Materials Processing Technology
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectChemical Etchingen_US
dc.subjectCopper Depth Of Etchen_US
dc.subjectSurface Roughnessen_US
dc.titleChemical etching of Cu-ETP copperen_US
dc.titleChemical etching of Cu-ETP copper
dc.typeConference Objecten_US

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