Chemical etching of Cu-ETP copper
[ X ]
Tarih
2005
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Elsevier Science Sa
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
Chemical etching is the controlled dissolution of workpiece material by contact with strong chemical solution. The process can be applied to any material. Copper is one of the extensively used engineering material in the fabrication of microelectronic components, microengineered structures and precision parts by using chemical etching process. In this study, copper is chemically etched. with two different etchants (ferric chloride and cupric chloride) at 50 degrees C. The effects of selected etchants and machining conditions on the depth of etch and surface roughness were investigated. The experimental study provided that ferric chloride produced the fastest chemical etch rate, but cupric chloride produced the smoothest surface quality. (c) 2005 Elsevier B.V. All rights reserved.
Açıklama
8th International Conference on Advances in Materials and Processing Technologies/13th International Conference on Achievements in Mechanical and Materials Engineering -- MAY 16-19, 2005 -- Gliwice Wisla, POLAND
Anahtar Kelimeler
Chemical Etching, Copper Depth Of Etch, Surface Roughness
Kaynak
Journal of Materials Processing Technology
WoS Q Değeri
Q2
Scopus Q Değeri
Q1
Cilt
162
