Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint

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dc.authorid0000-0001-8903-5426en_US
dc.contributor.authorBashir, M. Nasir
dc.contributor.authorSaad, Hafız Muhammad
dc.contributor.authorRizwan, Muhammad
dc.contributor.authorBingöl, Sedat
dc.contributor.authorChanna, Iftikhar Ahmed
dc.contributor.authorHaseeb, Abdul S.Md Abdul
dc.contributor.authorNaher, Sumsun
dc.date.accessioned2024-03-19T08:24:47Z
dc.date.available2024-03-19T08:24:47Z
dc.date.issued2022en_US
dc.departmentDicle Üniversitesi, Mühendislik Fakültesi, Makine Mühendisliği Bölümüen_US
dc.description.abstractBrittle phases are responsible for crack formation and propagation in tin–bismuth (Sn–58Bi) solder material. The purpose of this work is to investigate the effects of various cobalt (Co) nanoparticle (NP) concentrations on the tensile properties of the Sn–58Bi solder matrix. Different aging times were studied to find out the effect of Co NP on ultimate tensile strength. Tin–bismuth solder joints of different Co NP concentrations of 0%, 0.5%, 1%, and 2% were prepared. The reflow process was done at 180 °C for 1 min. Scanning Electron Microscopy and Energy-Dispersive X-ray spectroscopy were used to analyze the solder joints. The tensile test was carried out for the Sn–58Bi and Sn–58Bi–xCo (x = 0.5, 1, and 2) solder joints. The tensile test was run before and after aging time. The tensile results reveal that the addition of Co NP increased the tensile strength significantly at different concentrations of Co NP. The Tensile test revealed that ductility was improved as the temperature was increased. As the aging time increased, the ultimate tensile strength of all samples decreased.en_US
dc.identifier.citationBashir M. N., Saad, H. M., Rizwan, M. Bingöl, S., Channa, I. A., Gül, M. ve diğerleri. (2022). Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint. Journal of Materials Science: Materials in Electronics, 33(28), 22573-22579.en_US
dc.identifier.doi10.1007/s10854-022-09035-6
dc.identifier.endpage22579en_US
dc.identifier.issn0957-4522
dc.identifier.issue28en_US
dc.identifier.scopus2-s2.0-85138514355
dc.identifier.scopusqualityQ2
dc.identifier.startpage22573en_US
dc.identifier.urihttps://link.springer.com/article/10.1007/s10854-022-09035-6
dc.identifier.urihttps://hdl.handle.net/11468/13630
dc.identifier.volume33en_US
dc.identifier.wosWOS:000857991600001
dc.identifier.wosqualityQ2
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthorBingöl, Sedat
dc.language.isoenen_US
dc.publisherSpringeren_US
dc.relation.ispartofJournal of Materials Science: Materials in Electronics
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectCobalten_US
dc.subjectEnergy dispersive spectroscopyen_US
dc.subjectNanoparticlesen_US
dc.titleEffect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder jointen_US
dc.titleEffect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint
dc.typeArticleen_US

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