A novel approach based on grey simplified best–worst method and grey possibility degree for evaluating materials in semiconductor industries

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dc.authorid0000-0003-1579-1557en_US
dc.authorid0000-0002-0650-2584en_US
dc.contributor.authorEmamat, Mir Seyed Mohammad Mohsen
dc.contributor.authorWakeel, Saif
dc.contributor.authorAmiri, Maghsoud
dc.contributor.authorAhmad, Shafi
dc.contributor.authorBingol, Sedat
dc.date.accessioned2023-10-16T12:05:02Z
dc.date.available2023-10-16T12:05:02Z
dc.date.issued2023en_US
dc.departmentDicle Üniversitesi, Mühendislik Fakültesi, Makine Mühendisliği Bölümüen_US
dc.description.abstractThe reliability of flip-chip packages is significantly impacted by the type of packaging materials, such as underfill, solder, flux, and solder mask. Underfill reduces the coefficient of thermal expansion (CTE) mismatch between the semiconductor chip and printed circuit board, thereby minimizing the chances of thermal fatigue failure of the package. There are a plethora of underfill suppliers and selecting the most suitable underfill for preparing a flip-chip package is critical as there are conflicting criteria. These criteria are limited to glass transition temperature (Tg), CTE, elastic modulus (E), coefficient of moisture expansion, fracture toughness (Kic), shear strength, and flowability. Choosing appropriate alternatives based on the above conflicting criteria is basically a multi-criteria problem. This research proposes a grey simplified best–worst method (GSBWM) to identify the criteria weight. The proposed method has less calculation complexity than the previous grey best–worst methods, and it does not need operations research and modeling knowledge, and optimization software to solve it. The accuracy of the GSBWM is investigated using three data sets. The results showed the high accuracy of the proposed method in all data sets. This study employed the combination of GSBWM and a grey possibility degree based method to select the most suitable underfill material for reliable flip-chip packages as a real-world problem.en_US
dc.identifier.citationEmamat, M. S. M. M., Wakeel, S., Amiri, M., Ahmad, S. ve Bingöl, S. (2023). A novel approach based on grey simplified best–worst method and grey possibility degree for evaluating materials in semiconductor industries. Soft Computing, 27(22), 17043-17062.en_US
dc.identifier.doi10.1007/s00500-023-08668-x
dc.identifier.endpage17062en_US
dc.identifier.issn1432-7643
dc.identifier.issue22en_US
dc.identifier.scopus2-s2.0-85161593562
dc.identifier.scopusqualityQ1
dc.identifier.startpage17043en_US
dc.identifier.urihttps://link.springer.com/article/10.1007/s00500-023-08668-x
dc.identifier.urihttps://hdl.handle.net/11468/12820
dc.identifier.volume27en_US
dc.identifier.wosWOS:001003122200002
dc.identifier.wosqualityN/A
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthorBingöl, Sedat
dc.language.isoenen_US
dc.publisherSpringer Science and Business Mediaen_US
dc.relation.ispartofSoft Computing
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectUnderfill selectionen_US
dc.subjectReliability of flip-chip packageen_US
dc.subjectMaterial selectionen_US
dc.subjectGrey simplified best–worst method (GSBWM)en_US
dc.subjectGrey possibility degreeen_US
dc.titleA novel approach based on grey simplified best–worst method and grey possibility degree for evaluating materials in semiconductor industriesen_US
dc.titleA novel approach based on grey simplified best–worst method and grey possibility degree for evaluating materials in semiconductor industries
dc.typeArticleen_US

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