A novel approach based on grey simplified best–worst method and grey possibility degree for evaluating materials in semiconductor industries
Yükleniyor...
Tarih
2023
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Springer Science and Business Media
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
The reliability of flip-chip packages is significantly impacted by the type of packaging materials, such as underfill, solder, flux, and solder mask. Underfill reduces the coefficient of thermal expansion (CTE) mismatch between the semiconductor chip and printed circuit board, thereby minimizing the chances of thermal fatigue failure of the package. There are a plethora of underfill suppliers and selecting the most suitable underfill for preparing a flip-chip package is critical as there are conflicting criteria. These criteria are limited to glass transition temperature (Tg), CTE, elastic modulus (E), coefficient of moisture expansion, fracture toughness (Kic), shear strength, and flowability. Choosing appropriate alternatives based on the above conflicting criteria is basically a multi-criteria problem. This research proposes a grey simplified best–worst method (GSBWM) to identify the criteria weight. The proposed method has less calculation complexity than the previous grey best–worst methods, and it does not need operations research and modeling knowledge, and optimization software to solve it. The accuracy of the GSBWM is investigated using three data sets. The results showed the high accuracy of the proposed method in all data sets. This study employed the combination of GSBWM and a grey possibility degree based method to select the most suitable underfill material for reliable flip-chip packages as a real-world problem.
Açıklama
Anahtar Kelimeler
Underfill selection, Reliability of flip-chip package, Material selection, Grey simplified best–worst method (GSBWM), Grey possibility degree
Kaynak
Soft Computing
WoS Q Değeri
N/A
Scopus Q Değeri
Q1
Cilt
27
Sayı
22
Künye
Emamat, M. S. M. M., Wakeel, S., Amiri, M., Ahmad, S. ve Bingöl, S. (2023). A novel approach based on grey simplified best–worst method and grey possibility degree for evaluating materials in semiconductor industries. Soft Computing, 27(22), 17043-17062.
