The effect of the process temperature on the bondability in transient liquid phase (tlp) diffusion bonding of AISI 430 ferritic stainless steel with nodular (spheroid) cast iron using a copper interlayer
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Tarih
2006
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Yayıncı
Carl Hanser Verlag
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
The effect of the process temperature on the bondability in the transient liquid phase (tlp) was studied. The diffusion bonding of AISI 430 with nodular cast iron using a copper interlayer was investigated experimentally under a protective atmosphere at various temperatures and at a defined constant blow pressure which would cause macro deformation. Microstructure examinations were carried out with the help of optical microscopy, SEM and EDS. Hardness values were measured by HV scale under a load of 150 g. At the bond interface, decarburized and dechromised regions were observed on the ductile cast iron side and stainless steel side respectively. Best mechanical and metallurgical properties were observed for the specimen bonded at 1100 degrees C for 20 min. As a function of an elevation of the process temperature, an increase in the amount of graphite atoms that migrated toward the interface and a reduction at the nodular graphite diameters was noticed.
Açıklama
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Kaynak
Praktische Metallographie-Practical Metallography
WoS Q Değeri
Q3
Scopus Q Değeri
Q4
Cilt
43
Sayı
11
