The effect of the process temperature on the bondability in transient liquid phase (tlp) diffusion bonding of AISI 430 ferritic stainless steel with nodular (spheroid) cast iron using a copper interlayer için istatistikler
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The effect of the process temperature on the bondability in transient liquid phase (tlp) diffusion bonding of AISI 430 ferritic stainless steel with nodular (spheroid) cast iron using a copper interlayer | 0 |
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