Constituents and performance of no-clean flux for electronic solder

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dc.contributor.authorWakeel, Saif
dc.contributor.authorHaseeb, A. S. M. A.
dc.contributor.authorAfifi, M. A.
dc.contributor.authorBingöl, Sedat
dc.contributor.authorHoon, Khoo Ly
dc.date.accessioned2022-12-15T12:49:30Z
dc.date.available2022-12-15T12:49:30Z
dc.date.issued2021en_US
dc.departmentDicle Üniversitesi, Mühendislik Fakültesi, Makine Mühendisliği Bölümüen_US
dc.description.abstractCorrosion reliability is a severe concern related no-clean flux (NCF) residue. It results in a decreased life span of electronic devices, specially fine pitch assemblies. NCFs are formulated from various organic/inorganic components viz. activator, solvent, surfactant, and additive. Each constituent of a flux has specific functions, and its advantages and limitations. The first part of this review paper describes the constituents of NCF, their characteristics and their compositional ranges. The effects of process parameters such as soldering process and soldering temperature on the performance of NCF are then presented in the second part. Finally, the effects of flux residue on the underfill and reliability of flip-chip packaging are discussed. Carboxylic acid containing less number of carboxyl functional group, lower decomposition temperature, lower solubility, higher acid dissociation constant and higher chain length can increase the cleaning efficiency of NCF. Hybrid activators (amine+carboxylic acid) are advantageous in terms of improving the cleaning action and also increasing interactions with underfill. Lower boiling point solvents are preferable as they are the main evaporating constituent. Reflow soldering has been proven as a better choice for NCF at the soldering temperature range of 200-250 degrees C, as it leaves minimum flux residue. Besides, incompatible residue on solder mask or die surface can hinder the flow of underfill and flux residue outgassing during curing generates voids and delamination. Therefore, to formulate an efficient NCF, the characteristics of its constituents need to be understood and the flux composition optimized.en_US
dc.identifier.citationWakeel, S., Haseeb, A. S. M. A., Afifi, M. A., Bingöl, S. ve Hoon, K.L. (2021). Constituents and performance of no-clean flux for electronic solder. Microelectronics Reliability, 123, 1-12.en_US
dc.identifier.doi10.1016/j.microrel.2021.114177
dc.identifier.endpage12en_US
dc.identifier.issn0026-2714
dc.identifier.issn1872-941X
dc.identifier.scopus2-s2.0-85108171322
dc.identifier.scopusqualityQ2
dc.identifier.startpage1en_US
dc.identifier.urihttps://www.sciencedirect.com/science/article/pii/S0026271421001438?via%3Dihub
dc.identifier.urihttps://hdl.handle.net/11468/11070
dc.identifier.volume123en_US
dc.identifier.wosWOS:000687828700003
dc.identifier.wosqualityQ4
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthorBingöl, Sedat
dc.language.isoenen_US
dc.publisherPergamon-Elsevier Science LTDen_US
dc.relation.ispartofMicroelectronics Reliability
dc.relation.publicationcategoryDiğeren_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectChemistry of no-clean fluxen_US
dc.subjectSoldering processen_US
dc.subjectFlux residueen_US
dc.subjectHygroscopicityen_US
dc.subjectUnderfill compatibilityen_US
dc.titleConstituents and performance of no-clean flux for electronic solderen_US
dc.titleConstituents and performance of no-clean flux for electronic solder
dc.typeOtheren_US

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