Supplier selection for high temperature die attach by hybrid entropy-range of value MCDM technique: A semiconductor industry

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dc.contributor.authorWakeel, Saif
dc.contributor.authorAhmad, Shafi
dc.contributor.authorBingöl, Sedat
dc.contributor.authorBashir, Muhammad Nasir
dc.contributor.authorPaçal, Tuğçe Cemre
dc.contributor.authorKhan, Zahid Akhtar
dc.contributor.orcid0000-0002-3595-3878
dc.contributor.orcid0000-0001-9620-5980
dc.date.accessioned2024-04-24T17:56:25Z
dc.date.available2024-04-24T17:56:25Z
dc.date.issued2020
dc.departmentDicle Üniversitesi, Mühendislik Fakültesi, Makine Mühendisliği Bölümüen_US
dc.description21st International Conference on Electronic Packaging Technology, ICEPT 2020 -- 12 August 2020 through 15 August 2020 -- -- 163415en_US
dc.description.abstractDemands of High temperature die attach material (HTDM) are growing to increase the efficiency of Microelectronic packaging. However, Appropriate HTDM supplier selection is one of the major concerns for semiconductors industries due to various conflicting criteria. This study will employ a multicriteria decision making modelling (MCDM) to select the suitable HTDM supplier. Seven different international HTDM supplier (S1, S2, S3, S4, S5,S6,S7) are ranked based on eight conflicting criteria (electrical resistivity, thermal conductivity, impression, management system, production facility, geographical location, response speed and use of technology) by employing hybrid entropy-range of value (E-ROV) method. The result of this study showed that S7 is the most suitable supplier as it occupies rank one in the modelling and S5 being a worst. Sensitivity analysis illustrated that the results of E-ROV are consistent and reliable. Based on these results, E-ROV method can also be applied for supplier selection of various production complex parts in semiconductor industry.en_US
dc.description.sponsorshipThis study was supported by Dicle Universitesi, MUHENDISLIK.20.003.en_US
dc.identifier.citationWakeel, S., Ahmad, S., Bingöl, S., Bashir, M. N., Paçal, T. C. ve Khan, Z. A. (2020). Supplier selection for high temperature die attach by hybrid entropy-range of value MCDM technique: A semiconductor industry. 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020.
dc.identifier.doi10.1109/ICEPT50128.2020.9202994
dc.identifier.isbn9781728168265
dc.identifier.scopus2-s2.0-85093362459
dc.identifier.scopusqualityN/A
dc.identifier.urihttps://doi.org/10.1109/ICEPT50128.2020.9202994
dc.identifier.urihttps://hdl.handle.net/11468/23506
dc.indekslendigikaynakScopus
dc.language.isoenen_US
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US
dc.relation.ispartof2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectEntropy-Range of value methoden_US
dc.subjectHigh temperature die attach material (Htdm)en_US
dc.subjectMcdmen_US
dc.subjectSensitivity analysisen_US
dc.subjectSilver Sintered Paste (Ag Paste)en_US
dc.titleSupplier selection for high temperature die attach by hybrid entropy-range of value MCDM technique: A semiconductor industryen_US
dc.titleSupplier selection for high temperature die attach by hybrid entropy-range of value MCDM technique: A semiconductor industry
dc.typeConference Objecten_US

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