Supplier selection for high temperature die attach by hybrid entropy-range of value MCDM technique: A semiconductor industry
Yükleniyor...
Tarih
2020
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Institute of Electrical and Electronics Engineers Inc.
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
Demands of High temperature die attach material (HTDM) are growing to increase the efficiency of Microelectronic packaging. However, Appropriate HTDM supplier selection is one of the major concerns for semiconductors industries due to various conflicting criteria. This study will employ a multicriteria decision making modelling (MCDM) to select the suitable HTDM supplier. Seven different international HTDM supplier (S1, S2, S3, S4, S5,S6,S7) are ranked based on eight conflicting criteria (electrical resistivity, thermal conductivity, impression, management system, production facility, geographical location, response speed and use of technology) by employing hybrid entropy-range of value (E-ROV) method. The result of this study showed that S7 is the most suitable supplier as it occupies rank one in the modelling and S5 being a worst. Sensitivity analysis illustrated that the results of E-ROV are consistent and reliable. Based on these results, E-ROV method can also be applied for supplier selection of various production complex parts in semiconductor industry.
Açıklama
21st International Conference on Electronic Packaging Technology, ICEPT 2020 -- 12 August 2020 through 15 August 2020 -- -- 163415
Anahtar Kelimeler
Entropy-Range of value method, High temperature die attach material (Htdm), Mcdm, Sensitivity analysis, Silver Sintered Paste (Ag Paste)
Kaynak
2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020
WoS Q Değeri
Scopus Q Değeri
N/A
Cilt
Sayı
Künye
Wakeel, S., Ahmad, S., Bingöl, S., Bashir, M. N., Paçal, T. C. ve Khan, Z. A. (2020). Supplier selection for high temperature die attach by hybrid entropy-range of value MCDM technique: A semiconductor industry. 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020.
