Transient liquid phase (tlp) diffusion bonding of Ti45Ni49Cu6 P/M components using Cu interlayer

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dc.contributor.authorKejanli, Haluk
dc.contributor.authorTaskin, Mustafa
dc.contributor.authorKolukisa, Sedat
dc.contributor.authorTopuz, Polat
dc.date.accessioned2024-04-24T15:59:46Z
dc.date.available2024-04-24T15:59:46Z
dc.date.issued2009
dc.departmentDicle Üniversitesien_US
dc.description.abstractIn this study, transient liquid phase diffusion bonding parameters of Ti45Ni49Cu6 P/M components using copper interlayer were experimentally investigated in a protective (argon) atmosphere. Bonding processes of sintered Ti45Ni49Cu6 P/M compacts were carried out at various temperatures and bonding periods while bonding pressure was kept unchanged. The process pressure, 20 MPa, was selected just below those which would cause macro deformations. Optical microscopy, scanning electron microscopy, and energy dispersive spectroscopy were employed for microstructure examinations. Shear strength and hardness (HB) of bonded specimens were measured at bond interface and parent materials for mechanical property evaluations. Along the bond interface, copper, titanium, and nickel atom mutual migration was observed. Structural tests, metallographic analysis have shown the integrity of the diffusion bonded hardware, bonded between 940 and 970A degrees C process temperatures, for 40-60-min bonding periods.en_US
dc.description.sponsorshipDicle University Research Committee [DUAPAK 03-MF-86]en_US
dc.description.sponsorshipThe authors are grateful to the Dicle University Research Committee since this work is suggested and supported through grant DUAPAK 03-MF-86. Special thanks to TUBITAK (The Scientific and Technological Research Council of Turkey) for their unfailing support to the researchers.en_US
dc.identifier.doi10.1007/s00170-008-1860-3
dc.identifier.endpage699en_US
dc.identifier.issn0268-3768
dc.identifier.issn1433-3015
dc.identifier.issue7-8en_US
dc.identifier.scopus2-s2.0-69649093457
dc.identifier.scopusqualityQ1
dc.identifier.startpage695en_US
dc.identifier.urihttps://doi.org/10.1007/s00170-008-1860-3
dc.identifier.urihttps://hdl.handle.net/11468/14251
dc.identifier.volume44en_US
dc.identifier.wosWOS:000269434300008
dc.identifier.wosqualityQ2
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.language.isoenen_US
dc.publisherSpringer London Ltden_US
dc.relation.ispartofInternational Journal of Advanced Manufacturing Technology
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectDiffusion Bondingen_US
dc.subjectTi Ni Cu Powder Metallurgy Componenten_US
dc.subjectTlpen_US
dc.subjectCopper Interlayeren_US
dc.titleTransient liquid phase (tlp) diffusion bonding of Ti45Ni49Cu6 P/M components using Cu interlayeren_US
dc.titleTransient liquid phase (tlp) diffusion bonding of Ti45Ni49Cu6 P/M components using Cu interlayer
dc.typeArticleen_US

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