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    Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint
    (Springer, 2022) Bashir, M. Nasir; Saad, Hafız Muhammad; Rizwan, Muhammad; Bingöl, Sedat; Channa, Iftikhar Ahmed; Haseeb, Abdul S.Md Abdul; Naher, Sumsun
    Brittle phases are responsible for crack formation and propagation in tin–bismuth (Sn–58Bi) solder material. The purpose of this work is to investigate the effects of various cobalt (Co) nanoparticle (NP) concentrations on the tensile properties of the Sn–58Bi solder matrix. Different aging times were studied to find out the effect of Co NP on ultimate tensile strength. Tin–bismuth solder joints of different Co NP concentrations of 0%, 0.5%, 1%, and 2% were prepared. The reflow process was done at 180 °C for 1 min. Scanning Electron Microscopy and Energy-Dispersive X-ray spectroscopy were used to analyze the solder joints. The tensile test was carried out for the Sn–58Bi and Sn–58Bi–xCo (x = 0.5, 1, and 2) solder joints. The tensile test was run before and after aging time. The tensile results reveal that the addition of Co NP increased the tensile strength significantly at different concentrations of Co NP. The Tensile test revealed that ductility was improved as the temperature was increased. As the aging time increased, the ultimate tensile strength of all samples decreased.