Yazar "Emamat, Mir Seyed Mohammad Mohsen" seçeneğine göre listele

Listeleniyor 1 - 2 / 2
  • Küçük Resim
    Öğe
    A New hybrid LGPMBWM-PIV method for automotive material selection
    (Slovensko Drustvo Informatika, 2021) Wakeel, Saif; Bingöl, Sedat; Ahmad, Shafi; Bashir, M. Nasir; Emamat, Mir Seyed Mohammad Mohsen; Ding, Zhou; Fayaz, H.
    Efforts are continuously being made by researchers to improve fuel efficiency and to reduce CO2 emissions from the passenger cars. To achieve these goal, recent trend is to make the cars components light in weight for which manufacturing car roofs using natural fiber reinforced composites (NFCs) is one of the method. Several natural fibers (NFs)are available as alternative reinforcements for the fabrication of NFCs. Different NFs possess different properties and therefore, it is necessary to select the most appropriate natural fiber for fabrication of the composites which in turn will lead to the desired performance of the vehicle. Selection of the optimal natural fiber, amongst the several alternatives, is basically a multi criteria decision making (MCDM) problem as selection is based on the evaluation of several conflicting criteria. In this study, twelve alternative natural fibers (Flax, Hemp, Jute, Kenaf, Ramie, Okra, PALF, Coir, Isora, Cotton, Banana and Sisal) and six evaluation criteria (Tensile strength, Stiffness, Failure strain, Density, Degradation temperature and Moisture gain) are considered and selection of the optimal NF is made using a newly developed hybrid MCDM method i.e. Linear goal programming model for Best-Worst method (LGPMBWM) and Proximity index value method (PIV). Results of the study reveal that among all considered natural fibers, Ramie fiber is the most suitable alternative for the fabrication of composites and coir fiber is the worst candidate for the same. Ranking results were also supported by five other MCDM methods as there was a strong correlation between PIV and other MCDM methods.
  • Küçük Resim
    Öğe
    A novel approach based on grey simplified best–worst method and grey possibility degree for evaluating materials in semiconductor industries
    (Springer Science and Business Media, 2023) Emamat, Mir Seyed Mohammad Mohsen; Wakeel, Saif; Amiri, Maghsoud; Ahmad, Shafi; Bingol, Sedat
    The reliability of flip-chip packages is significantly impacted by the type of packaging materials, such as underfill, solder, flux, and solder mask. Underfill reduces the coefficient of thermal expansion (CTE) mismatch between the semiconductor chip and printed circuit board, thereby minimizing the chances of thermal fatigue failure of the package. There are a plethora of underfill suppliers and selecting the most suitable underfill for preparing a flip-chip package is critical as there are conflicting criteria. These criteria are limited to glass transition temperature (Tg), CTE, elastic modulus (E), coefficient of moisture expansion, fracture toughness (Kic), shear strength, and flowability. Choosing appropriate alternatives based on the above conflicting criteria is basically a multi-criteria problem. This research proposes a grey simplified best–worst method (GSBWM) to identify the criteria weight. The proposed method has less calculation complexity than the previous grey best–worst methods, and it does not need operations research and modeling knowledge, and optimization software to solve it. The accuracy of the GSBWM is investigated using three data sets. The results showed the high accuracy of the proposed method in all data sets. This study employed the combination of GSBWM and a grey possibility degree based method to select the most suitable underfill material for reliable flip-chip packages as a real-world problem.