Browsing by Author "Pacal T.C."

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Supplier Selection for High Temperature Die Attach by hybrid Entropy-Range of Value MCDM Technique: A Semiconductor Industry

Wakeel S.; Ahmad S.; Bingol S.; Bashir M.N.; Pacal T.C.; Khan Z.A. (Institute of Electrical and Electronics Engineers Inc., 2020)

Demands of High temperature die attach material (HTDM) are growing to increase the efficiency of Microelectronic packaging. However, Appropriate HTDM supplier selection is one of the major concerns for semiconductors ...