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    Mechanical Properties of Ferrochrome Based Hardfacing Layers Coated on AISI 1020 Steel Obtained by the Aid of Plasma Transfer Arc (PTA) Process
    (Carl Hanser Verlag, 2010) Cay, Vedat Veil; Ozan, Sermin; Topuz, Polat; Kolukisa, Sedat
    Mechanical properties of ferrochrome based hardfacing layers coated on AISI 1020 steel obtained by the aid of Plasma Transfer Arc (PTA) was experimentally studied. Ferrochrome powders were mixed with sodium silicate gel to avoid spreading. The mixture was laid to 1.5 x 8 x 100 mm slots machined on AISI 1020 steel. Hardfacing layer was performed by PTA process under pure Argon as protective gas with 130 A/20 V power supply. Scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), micro hardness and abrasive tests were employed for the evaluation of ferrochrome alloyed coating. Hardfacing was successfully performed under given conditions. Microstructural changes and formations (phases) significantly improved hardness, abrasive wear resistance and integrity of hardfacing layer.
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    Transient liquid phase (tlp) diffusion bonding of Ti45Ni49Cu6 P/M components using Cu interlayer
    (Springer London Ltd, 2009) Kejanli, Haluk; Taskin, Mustafa; Kolukisa, Sedat; Topuz, Polat
    In this study, transient liquid phase diffusion bonding parameters of Ti45Ni49Cu6 P/M components using copper interlayer were experimentally investigated in a protective (argon) atmosphere. Bonding processes of sintered Ti45Ni49Cu6 P/M compacts were carried out at various temperatures and bonding periods while bonding pressure was kept unchanged. The process pressure, 20 MPa, was selected just below those which would cause macro deformations. Optical microscopy, scanning electron microscopy, and energy dispersive spectroscopy were employed for microstructure examinations. Shear strength and hardness (HB) of bonded specimens were measured at bond interface and parent materials for mechanical property evaluations. Along the bond interface, copper, titanium, and nickel atom mutual migration was observed. Structural tests, metallographic analysis have shown the integrity of the diffusion bonded hardware, bonded between 940 and 970A degrees C process temperatures, for 40-60-min bonding periods.